Housing for electronic apparatus and method of damping unwanted radiation of electromagnetic waves
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United States of America Patent
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Nov 24, 1998
Grant Date -
N/A
app pub date -
Jun 11, 1996
filing date -
Jun 21, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A housing for electronic apparatus which is effectively protected against electromagnetic wave leakage, the housing being equipped or lined, in an area of the conductive layer-carrying inside surface of the housing, the area adjoining, or is in the vicinity of, an opening of the housing, with a sheet molded, to a thickness of 70 to 300 .mu.m, from a magnetic material-containing resin composition comprising 7 to 60% by weight of a binder resin (a) and 40 to 93% by weight of a finely divided magnetic material (b) having a magnetic loss term, and a method of damping unwanted radiation of electromagnetic waves.
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