Modular payload arrangement
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 24, 1998
Grant Date -
N/A
app pub date -
Dec 22, 1995
filing date -
Dec 22, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A modular payload structure providing standardized thermal, electrical and mechanical interfaces. The modular arrangement of the present invention has fixed radiator panels that have standard thermal and mechanical interfaces, allowing communication modules to 'plug in' directly to the payload structure. In the case of high thermo-energy dissipating modules, heat pipes on the modules connect to the thermal interfaces and move energy from the modules to the thermal interfaces of the radiator panel.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully