Acoustic wave devices on diamond with an interlayer
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United States of America Patent
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Nov 17, 1998
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N/A
app pub date -
Feb 18, 1997
filing date -
Feb 18, 1997
priority date (Note) -
Expired
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Abstract
Embedded IDT electrodes are provided in a multilayer structure consisting of a diamond layer on a substrate with IDT electrodes formed on the diamond and a very thin interlayer covering the interdigitated transducer structure and the diamond, thus embedding the IDT electrodes between the diamond layer and the interlayer, with a piezoelectric layer on the interlayer so that an acoustic surface wave propagates in the diamond layer. The very thin interlayer between the diamond and the piezoelectric layer greatly increases the uniformity of the piezoelectric layer but does not interfere with the acoustic properties of a SAW device.
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