Memory card and its manufacturing method
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United States of America Patent
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Nov 17, 1998
Issued Date -
N/A
app pub date -
Aug 31, 1995
filing date -
Jul 15, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a memory card having circuit elements such as a semiconductor device and transmitting/receiving device mounted on a synthetic resin substrate shaped like a flat plate, the circuit elements are disposed and sealed in the synthetic resin substrate, and both surfaces of the substrate are covered with synthetic resin sheet members. This achieves a memory card, which is resistant to bending and also survives harsh operating environment. Also provided are a memory card, which can be easily developed into a multi-function card such as an ID card at low cost, and its manufacturing method.
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