Heat curable binder systems and their use
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United States of America Patent
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Nov 17, 1998
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N/A
app pub date -
Dec 11, 1996
filing date -
Dec 11, 1996
priority date (Note) -
Expired
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Abstract
This invention relates to heat cured binder systems comprising as separate Parts: Part I comprising (a) a soluble source of silica, (b) an alcohol, and preferably (c) a surfactant; and Part II comprising an alkali aluminate. The binder systems are mixed with a refractory to form a refractory mix. The resulting refractory mix is shaped and heated at an elevated temperature to form a cured refractory shape, particularly a preform. Heat is applied by warm air, baking in an oven, microwave, or preferably by hot-box equipment.
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