Use of conductive particles in a nonconductive body as an integrated circuit antifuse
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United States of America Patent
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Nov 10, 1998
Issued Date -
N/A
app pub date -
Mar 14, 1995
filing date -
Feb 8, 1994
priority date (Note) -
Expired
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Abstract
A novel antifuse includes a composite of conductive particles dispersed throughout a nonconductive matrix, which composite is located inside an antifuse via. The antifuse via is defined by a dielectric layer that separates two electrodes. The electrodes can be located in the same conductive layer plane (typically parallel to and isolated from one another) or in two different conductive planes (typically formed transverse to one another and separated by a dielectric with an antifuse via formed therein). The electrodes can be coupled to, for example, active or passive regions of the integrated circuit. One embodiment of an antifuse (also called 'composite antifuse') has only the composite in an antifuse via between the two conductive layers. Another embodiment of an antifuse (also called 'hybrid antifuse') includes in addition to the composite, one or more thin dielectric layers also located in the antifuse via between the two conductive layers.
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