Lead frame taping apparatus and taping method
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United States of America Patent
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Nov 10, 1998
Grant Date -
N/A
app pub date -
Oct 25, 1996
filing date -
Oct 25, 1995
priority date (Note) -
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Abstract
In a lead frame taping apparatus and a method thereof, a plurality of punching portions are provided and each punching portion concurrently attaches a tape to at least two lead frames. Also, the tape can be continuously attached to the different kinds of a lead frame without the exchange of molds by differing the operation time of each punching portion. Further, a taping detecting sensor is provided to detect the attachment of the tape at the lead frame. Therefore, productivity is increased while saving labor and inferior products can be accurately detected.
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