Encapsulation for electronic components and method for producing the encapsulation
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United States of America Patent
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Nov 3, 1998
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N/A
app pub date -
Nov 4, 1996
filing date -
May 2, 1994
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Abstract
An encapsulation for SAW components and a method for producing the encapsulation use a cap to seal component structures on a substrate. The cap is in the form of a cover on the substrate and has cutouts which accommodate the component structures in regions of the component structures.
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