Pressure sensor package and method of making the same
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United States of America Patent
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Nov 3, 1998
Grant Date -
N/A
app pub date -
Apr 4, 1996
filing date -
Apr 4, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pressure sensor package and a method of producing the same. The package includes a pressure sensor base, a pressure sensor diaphragm positioned over the base, and a sealing ring positioned over the pressure sensor diaphragm and creating an interference fit with the pressure sensor base. The sealing ring forms a mechanical interference with the pressure sensor base by either positioning the ring within an under cut in a sidewall of the base or deforming a portion of the base over the top of the ring. The pressure sensor base includes a recess having a bottom surface and a groove in the bottom surface, and the sealing ring and/or the pressure sensor diaphragm is positioned within the groove. The package further includes external threads for securing the package to a threaded orifice, the external threads being positioned on the output side of the package, as defined by the diaphragm.
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