Process for fabricating electronic circuits with anodically oxidized scandium doped aluminum wiring
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United States of America Patent
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Nov 3, 1998
Issued Date -
N/A
app pub date -
May 28, 1996
filing date -
Feb 22, 1993
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Expired
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Abstract
A process for fabricating an electronic circuit by oxidizing the surroundings of a metallic interconnection such as of aluminum, tantalum, and titanium, wherein anodic oxidation is effected at a temperature not higher than room temperature, preferably, at 10.degree. C. or lower, and more preferably, at 0.degree. C. or lower. The surface oxidation rate of a metallic interconnection can be maintained constant to provide a surface free of irregularities.
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