Method of manufacturing multilayer printed wiring board
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United States of America Patent
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Oct 27, 1998
Grant Date -
N/A
app pub date -
Dec 18, 1996
filing date -
Dec 28, 1995
priority date (Note) -
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Abstract
In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole formed in the insulating resin layer and communicating with the internal wiring circuit, and a conductive portion formed on an inner wall of the blind hole and connected to the internal wiring circuit, the blind hole is formed by using a short-pulse CO.sub.2 laser.
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