High heat density transfer device
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United States of America Patent
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Oct 20, 1998
Issued Date -
N/A
app pub date -
Feb 5, 1997
filing date -
Oct 20, 1994
priority date (Note) -
Expired
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Abstract
Heat transfer device (30) dissipates and removes heat energy from a heat source and delivers the heat energy to a heat sink. Heat transfer device (30) includes diamond substrate (32) for receiving the heat energy from the heat source. Interconnect point (36) connects to diamond substrate (32). Fiber (34), such as a carbon fiber, connects at interconnect point (36) to receive the heat energy from diamond substrate (32) and conduct the heat energy to the heat sink.
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