Semiconductor device in which semiconductor chip has bottom surface with reduced level of organic compounds relatively to other sufaces thereof
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United States of America Patent
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Oct 13, 1998
Issued Date -
N/A
app pub date -
Aug 28, 1997
filing date -
Sep 20, 1993
priority date (Note) -
Expired
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Abstract
A method of manufacturing a semiconductor device which includes a semiconductor chip and a plastic package of a thermosetting polymer encapsulating the semiconductor chip through a molding process. The thermosetting polymer of the plastic package fully or partially covers a bottom surface of the semiconductor chip. An ultraviolet cleaning process is performed for cleaning the bottom surface of the semiconductor chip prior to the molding process.
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