Hermetic sealing composition
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Oct 13, 1998
Issued Date -
N/A
app pub date -
Apr 18, 1997
filing date -
Aug 22, 1995
priority date (Note) -
Expired
status (Latency Note)
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Importance

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Abstract
A hermetic sealing composition comprising 100 parts by weight of a basic composition consisting of from 80 to 99.9 wt % of a crystalline low melting glass powder containing lead and boron and from 0.1 to 20 wt % of a low expansion ceramic filler, and from 0.001 to 1.0 part by weight, in total, of at least one of an .alpha.-4PbO.B.sub.2 O.sub.3 crystal powder and a Pb.sub.3 O.sub.4 powder, incorporated to the basic composition, the thermal expansion coefficient of the sealing composition after firing being from 80.times.10.sup.-7 to 105.times.10.sup.-7 /.degree.C. within a range of from room temperature to 300.degree. C.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ASAHI TECHNO GLASS CORPORATION | 1-50-1 GOYDA FUNABASHI-SHI CHIBA 273-0044 |
International Classification(s)

- 1997 Application Filing Year
- C03C Class
- 265 Applications Filed
- 134 Patents Issued To-Date
- 50.57 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Kuroki, Yuichi | Funabashi, JP | 39 | 595 |
# of filed Patents : 39 Total Citations : 595 | |||
Nakamura, Akira | Funabashi, JP | 310 | 3171 |
# of filed Patents : 310 Total Citations : 3171 | |||
Rokudai, Satoshi | Funabashi, JP | 4 | 8 |
# of filed Patents : 4 Total Citations : 8 | |||
Tanabe, Ryuichi | Yokohama, JP | 11 | 139 |
# of filed Patents : 11 Total Citations : 139 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 2 Citation Count
- C03C Class
- 0.40 % this patent is cited more than
- 27 Age
Forward Cite Landscape
- No Forward Cites to Display

Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

Legal Events
Date | Code | Event | Description |
---|---|---|---|
Nov 08, 2010 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Oct 13, 2010 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Oct 13, 2010 |
Oct 13, 2010 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | |
May 17, 2010 | REMI | MAINTENANCE FEE REMINDER MAILED | |
Mar 17, 2006 | FPAY | FEE PAYMENT | year of fee payment: 8 |
Mar 21, 2002 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Dec 13, 1999 | AS | ASSIGNMENT | free format text: CHANGE OF CORPORATE ADDRESS;ASSIGNOR:ASAHI GLASS COMPANY LTD.;REEL/FRAME:010557/0067 Owner name: ASAHI GLASS COMPANY LTD., JAPAN Effective Date: Dec 13, 1999 |
Jan 04, 1999 | AS | ASSIGNMENT | free format text: CHANGE OF NAME;ASSIGNOR:IWAKI GLASS COMPANY LTD.;REEL/FRAME:011204/0377 Owner name: ASAHI TECHNO GLASS CORPORATION, JAPAN Effective Date: Jan 04, 1999 |
Dec 01, 1998 | FEPP | FEE PAYMENT PROCEDURE | free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
Oct 13, 1998 | I | Issuance | |
Apr 18, 1997 | F | Filing | |
Aug 22, 1995 | PD | Priority Date |

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