Circuit board having a metal matrix composite inlay
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United States of America Patent
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Oct 13, 1998
Grant Date -
N/A
app pub date -
Mar 30, 1995
filing date -
Mar 30, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A circuit board includes a substrate of ceramic material and conductive strips in form of a metal layer which is cast onto the surface of the substrate and formed through locally stripping metal layer from the substrate surface. The circuit board further includes a recess for receiving an inlay of metal matrix composite material.
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