Assembly including an active matrix liquid crystal display module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 6, 1998
Grant Date -
N/A
app pub date -
Sep 13, 1996
filing date -
Sep 13, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An assembly for dissipating heat from an active matrix liquid crystal display module while avoiding developing thermally induced mechanical stresses which can adversely affect the electro-optical properties of the liquid crystal material is disclosed. The module is affixed to a circuit board containing electrical leads for connection to drive electronics, in a way such that the substrate containing the active matrix elements is suspended through a window or through-hole in the circuit board and is sunken or nested into a soft elastomeric gel which is electrically non-conductive but thermally conductive. The gel provides the requisite thermal conductivity to dissipate the heat via a heat sink with which the gel is in thermal contact.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully