Electronic package cooling system and heat sink with heat transfer assembly
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United States of America Patent
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Oct 6, 1998
Issued Date -
N/A
app pub date -
May 5, 1997
filing date -
Jan 26, 1994
priority date (Note) -
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Abstract
A method for minimizing thermal overhead in an integrated circuit package is described. A heat sink having a base is integrally formed into the package. The base is connected to the die, and a portion of the heat sink projects from the package, forming a post. A heat transfer assembly having a shaft with an aperture is heated until the aperture expands sufficiently to allow the heat transfer assembly to be fitted on the post with a minimum of force. Upon cooling, a tight joint is formed between the heat sink and the heat transfer assembly.
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