Packaged semiconductor chip
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United States of America Patent
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Sep 29, 1998
Grant Date -
N/A
app pub date -
May 1, 1996
filing date -
Oct 4, 1995
priority date (Note) -
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Abstract
A semiconductor device includes a substrate having a recess; a semiconductor chip disposed in the recess; a plurality of external electrodes disposed on the substrate; a lid covering the recess; and a heat radiator disposed between the semiconductor chip and the substrate for transmitting heat generated by the semiconductor chip to the substrate for radiation.
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