High density cantilevered probe for electronic devices
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United States of America Patent
Stats
-
Sep 22, 1998
Grant Date -
N/A
app pub date -
Mar 12, 1996
filing date -
Nov 27, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Probes for electronic devices are described. The probe is formed by ball bonding a plurality of wires to contact locations on a fan out substrate surface. The wires are cut off leaving stubs. A patterned polymer sheet having electrical conductor patterns therein is disposed over the stubs which extend through holes in the sheet. The ends of the wires are flattened to remit the polymer sheet in place. The wire is connected to an electrical conductor on the polymer sheet which is converted to a contact pad on the polymer sheet. A second wire is ball bonded to the pad on the polymer sheet and cut to leave a second stub. The polymer sheet is laser cut so that each second stub is free to move independently of the other second studs. The ends of the second stubs are disposed against contact locations of an electronic device, such as an FC chip, to test the electronic device.
First Claim
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Cited Art Landscape
Patent Citation Ranking
- 261 Citation Count
- G01R Class
- 99.63 % this patent is cited more than
- 27 Age