Method for producing a smart card module for contactless smart cards
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United States of America Patent
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Sep 22, 1998
Grant Date -
N/A
app pub date -
Mar 5, 1997
filing date -
Sep 5, 1994
priority date (Note) -
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Abstract
A method for producing a smart card module includes bonding one end of a thin wire onto a first contact zone of a semiconductor chip. The wire is guided in a plurality of turns forming an antenna coil. The wire is bonded onto a second contact area of the semiconductor chip. The wire turns of the antenna coil and the semiconductor chip are placed on a carrier body.
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