Arrangement for handling wafer-shaped objects
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United States of America Patent
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Sep 15, 1998
Grant Date -
N/A
app pub date -
Jun 13, 1996
filing date -
Dec 28, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An arrangement for handling wafer-shaped objects is to ensure a high degree of positioning accuracy with increased productivity, freely selectable transport paths, and low mechanical expenditure under SMIF conditions. The arrangement has at least one indexing device for supplying and accepting the objects at a supplying and accepting location situated in a handling plane and at least one transporting device for transporting the wafer-shaped objects between the supplying and accepting location and a work station. The work station, together with at least one other work station, is arranged substantially coaxially to a central point through which passes a rotational axis of a changer. The arrangement is applicable in the manufacture of integrated circuits.
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