Method for producing a plated-through hole on a printed-circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 1, 1998
Grant Date -
N/A
app pub date -
Sep 23, 1996
filing date -
Nov 9, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for producing a plated-through hole on a printed-circuit board, whereby the printed-circuit board is initially bored, catalyzed, and patterned. The plated-through hole is then fashioned in an electrochemical deposition process so as to make it functional for the through-hole mounting of electrical components. The plating process is preferably carried out with nickel or nickel compounds, so that no additional corrosion protection is required. A direct bonding to the contact lands can be achieved by coating the contact lands with gold or palladium.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully