Process for depositing optical thin films on both planar and non-planar substrates
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United States of America Patent
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Aug 25, 1998
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N/A
app pub date -
Jul 7, 1994
filing date -
Feb 8, 1988
priority date (Note) -
Expired
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Abstract
A rotary cylindrical sputtering system incorporates separate, separately-controlled linear magnetron sputter deposition and reaction zones for sputter depositing materials such as refractory metals and forming oxides and other compounds and alloys of such materials. In one aspect, the associated process involves rotating or translating workpieces past the differentially pumped, atmospherically separated, sequentially or simultaneously operated deposition and reaction zones and is characterized by the ability to form a wide range of materials, by high throughput, and by the ability to form durable optical quality thin films of nominal refractive indices and controlled coating thickness, including both constant and selectively varied thickness profiles.
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