Printed circuit board and heat sink arrangement
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United States of America Patent
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-
Aug 18, 1998
Grant Date -
N/A
app pub date -
Nov 21, 1996
filing date -
Nov 21, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Making an assembly of a printed circuit board structure and heat sink structure by locating a thermally conductive surface release agent upon a side of one of the structures and causing a flowable thermally conductive material to flow through a hole in the heat sink and lie between the release agent and the other structure. The thermally conductive material lies in heat conductive contact with the release agent and with the other structure and in alignment with an electronic component which is to be cooled upon the board. The release agent ensures easy release of the printed circuit board structure from the heat sink structure for disassembly purposes. An assembly of the two structures is also covered.
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