Amplification circuit using wire-bonding for adjusting amplification factor

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United States of America Patent

PATENT NO 5796310
SERIAL NO

08761819

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Abstract

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An amplification circuit comprises an operational amplifier, an input resistance unit and a feedback resistance unit. The input resistance unit consists of a plurality of input resistances connected in series, and the feedback resistance unit consists of a plurality of feedback resistances connected in series. A plurality of adjusting pads are provided at respective connecting points of these input and feedback resistances. There is a common pad having an electrical potential fixed at a reference voltage. A first wire selectively bonds one of adjusting pads corresponding to the input resistances with the common pad to set a resistance value of the input resistance unit. And, a second wire selectively bonds one of adjusting pads corresponding to the feedback resistances with the common pad to set a resistance value of the feedback resistance unit.

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Patent Owner(s)

Patent OwnerAddress
DENSO CORPORATION1-1 SHOWA-CHO KARIYA-CITY AICHI-PREF 448-8661

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ariyosi, Hiromi Kariya, JP 1 8
Ohta, Tameharu Nishio, JP 24 407

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