Integral copper column with solder bump flip chip
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United States of America Patent
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Aug 4, 1998
Grant Date -
N/A
app pub date -
Sep 12, 1996
filing date -
Sep 12, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention includes an integral copper column with a solder bump flip chip. An integrated circuit chip is provided having an electrical circuit and including at least two contact pads. A thin layer of barrier metallization is provided over the contact pads. A support substrate is provided having a circuit layer with raised features that include copper traces. A solder bump connects the contact pad on the integrated circuit chip and the raised features of the flex circuit to provide an integral copper column with a solder bump flip chip.
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