Curable epoxy resin composition

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United States of America Patent

PATENT NO 5783644
SERIAL NO

08843331

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Abstract

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A curable epoxy resin composition comprising (I) an epoxy resin having more than one epoxy groups per one molecule, and (II) a specific Mannich base as essential components, with the amount of the Mannich base (II) being 1 to 50 parts by weight per 100 parts by weight of the epoxy resin (I), is lowly odoriferous and therefore easy of handling, is excellent in low-temperature curing characteristics, and its cured product exhibits excellent resistances to water, chemicals and amine blushing, and excellent physical properties.

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Patent Owner(s)

Patent OwnerAddress
ASAHI DENKA KOGYO K KTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ando, Kazuhiko Tokyo, JP 11 67
Suzuki, Hiroshi Tokyo, JP 997 14336

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  • 4 Citation Count
  • C08G Class
  • 3.35 % this patent is cited more than
  • 27 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges264651695724175311701 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475500

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