Minimum thickness force sensor with temperature compensation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 14, 1998
Grant Date -
N/A
app pub date -
Aug 7, 1996
filing date -
Aug 7, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A force sensor comprising a substrate, a conductive material providing an electrically discernible response to compressive stress disposed on the substrate, and a thermocouple disposed on the substrate proximate to the conductive material. A measurement processor is also described that includes first means for measuring electrical signals from the conductive material indicative of compressive stress, second means for measuring electrical signals from the thermocouple indicative of temperature in proximity to the conductive material, means for determining a temperature compensating factor derived from the electrical signals indicative of compressive stress and the electrical signals indicative of temperature, and means for determining a temperature compensated compressive stress value derived from the temperature compensating factor and the electrical signals indicative of compressive stress.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully