Polymers containing protected styrene and unprotected hydroxybenzyl (meth)acrylamides
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United States of America Patent
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Jul 14, 1998
Grant Date -
N/A
app pub date -
Oct 26, 1995
filing date -
Oct 26, 1994
priority date (Note) -
Expired
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Abstract
Novel polymers may be used in resist formulations for the fabrication of printing plates and circuit boards and, in particular, for the fabrication of integrated circuits. No autocatalytic decomposition of the compounds occurs and the resist film obtained therewith has good adhesive properties.
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