Power semiconductor module having elongate plug contacts
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United States of America Patent
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Jul 7, 1998
Grant Date -
N/A
app pub date -
Feb 6, 1996
filing date -
Feb 6, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A power semiconductor module is specified. It comprises a housing into which any desired power semiconductor circuit is installed. The power semiconductor circuit has at least two connections, which are passed out of the housing. According to the invention, the connections have the form of an elongate plug contact. An insulating plate may additionally be provided between the adjacent plug contacts. Reliable, yet easily releasable, low-inductance electrical contact is achieved by this form of the connections.
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