Heat exchanger assembly and method for making the same
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United States of America Patent
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Jul 7, 1998
Issued Date -
N/A
app pub date -
Feb 9, 1996
filing date -
Jan 14, 1994
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Expired
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Abstract
A heat exchanger assembly, having a first oxygen-rich copper base layer joined to a first layer of beryllium oxide, a first oxygen-rich copper layer joined to the first beryllium oxide layer, a second beryllium oxide layer joined to the first oxygen-rich copper layer, a second base layer of oxygen-rich copper joined to the second oxygen-rich copper layer, a second oxygen-rich copper base layer joined to the second beryllium oxide layer, and a heat exchanger structure direct bonded to the second base layer. The structure has a plurality of oxygen-rich copper fins stacked upon one another, each fin having a channel at a selected location therein. The material to material interfaces between adjacent stacked fins are joined to one another by direct bonding so as to form a solidified block structure. Each of the channels form a cooling chamber for receiving a fluid flow.
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