Resin composition to be plated
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United States of America Patent
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Jun 30, 1998
Issued Date -
N/A
app pub date -
Mar 11, 1997
filing date -
Mar 29, 1995
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Expired
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Abstract
A structure of a microporous resin bonded to metal is prepared by a method, comprising, molding a resin composition comprising a polymer alloy consisting of polyether imide and polyphenylene ether and particles of aluminum borate or amorphous silica filler, wherein the particles of aluminum borate and amorphous silica have an aspect ratio of 10 or less and an average diameter of 0.01-100 .mu.m, the aluminum borate having the formula: nAl.sub.2 O.sub.3.mB.sub.2 O.sub.3, wherein n and m individually represent an integer of 1-100, and the amorphous silica having the formula: SiO.sub.2, into a shaped object, treating the molded resin composition with an aqueous alkaline solution to remove the filler, thereby creating micropores within the resin object, and depositing a metal film on a surface of the treated resin object.
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