Adhesive compositions for electronic applications
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United States of America Patent
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Jun 30, 1998
Grant Date -
N/A
app pub date -
Nov 21, 1996
filing date -
Nov 21, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Adhesive compositions for electronic applications contain a hydroxyl-bearing resin, a thermoplastic urethane and a curing agent.
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