Wave soldering machine
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United States of America Patent
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Jun 30, 1998
Grant Date -
N/A
app pub date -
Aug 5, 1996
filing date -
Aug 7, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wave soldering machine welling up molten solder by means of a pump for soldering a printed circuit board. The wave soldering machine comprises a nozzle formed of an enclosure surrounded by a front upright, a rear upright and side plates, a rear baffle plate extended from the top edge of the rear upright in a manner that the height of the rear baffle plate is adjusted, and a generally L-shaped front baffle plate having a large radius of curvature pivotally attached to the top edge of the front upright, whereby a solder wave formed on the top end of the rear baffle plate by surface tension of molten solder flows along the top surface of the front baffle plate. The rear baffle plate is particularly shaped and a bypass is formed to present a stable solder wave.
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