Using a thermal barrier to provide a hermetic seal surface on aluminum nitride substrate electronic packages
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United States of America Patent
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Jun 23, 1998
Grant Date -
N/A
app pub date -
Feb 25, 1997
filing date -
Feb 25, 1997
priority date (Note) -
Expired
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Abstract
A hermetically sealed microelectronic package that uses a thermal barrier or interposer between a cover and an aluminum nitride substrate. A solder interface is disposed on an aluminum nitride substrate, and the thermal barrier is disposed on the solder interface. The cover is attached to the solder interface using a solder seal that solders the cover to the interposer to produce a hermetically sealed package. The thermal barrier or interposer permits low cost, low temperature soldering of metal covers to metallized aluminum nitride substrate and is compatible with volume production processing.
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