Method of transfer molding and a transfer molding machine

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United States of America Patent

PATENT NO 5770128
SERIAL NO

08157114

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Abstract

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Insert-parts are set onto a lower die (10), and resin tablets are supplied into pots (10a) for resin mold. A press mechanism A molds the insert-parts, a mold is opened, then the lower die (10) is slid to a first position, which is located side of a molding position. At the first position, an unloading mechanism (C) and a parts-loading mechanism (D) execute to clean parting faces of the mold, and to set resin tablets and insert-parts. The lower die (10) returns to the molding position for next molding. By sliding the lower die (10), works of taking out molded products, setting insert-parts, etc. can be easier, and the molding cycle time can be shortened.

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Patent Owner(s)

Patent OwnerAddress
APIC YAMADA CORPORATION90 OOAZA KAMITOKUMA CHIKUMA-SHI NAGANO 3890898 ?3890898

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Ryoichi Togura-machi, JP 8 105
Kobayashi, Kazuhiko Togura-machi, JP 222 3624
Miyashita, Yasuhiko Togura-machi, JP 2 11
Sawazaki, Kazumi Togura-machi, JP 1 9

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