Apparatus for wave soldering printed wiring boards
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United States of America Patent
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Jun 23, 1998
Grant Date -
N/A
app pub date -
Jul 19, 1996
filing date -
Aug 2, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A soldering device includes a solder vessel for containing a molten solder, solder ejecting nozzle disposed in the solder vessel for upwardly ejecting the molten solder to form a solder wave thereabove, a cover plate covering the vessel and having an opening such that the solder wave can pass therethrough, a nozzle forming body provided adjacent at least one side of the solder wave to define a thin space between the nozzle forming body and the cover plate, and a gas feed conduit connected to the nozzle forming body for feeding a gas to the thin space, so that the gas is jetted through the thin space and flows toward the solder wave.
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