Production of small metal bumps
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United States of America Patent
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Jun 16, 1998
Issued Date -
N/A
app pub date -
Jul 9, 1996
filing date -
Jul 11, 1995
priority date (Note) -
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Abstract
A process of producing small metal bumps includes the steps of simultaneously holding small metal balls on an arrangement baseplate in the positions corresponding to those of electrodes of a semiconductor chip, a film carrier, or a substrate; aligning the small metal balls held on the arrangement baseplate with the electrodes; lightly pressing the small metal balls against the electrodes; to provisionally fix the balls to the electrodes; and pressing the provisionally fixed small metal balls to flatten the pressed surfaces of the small metal balls, and at the same time, to bond the small metal balls to the electrodes.
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