Process of directly electroplating onto a nonconductive substrate
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United States of America Patent
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Jun 9, 1998
Grant Date -
N/A
app pub date -
May 2, 1996
filing date -
May 2, 1996
priority date (Note) -
Expired
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Abstract
A process of directly plating onto a nonconductive substrate is disclosed. The process comprises the steps of: 1) conditioning: modifying a surface of the nonconductive substrate with selected organic hydrocarbons or polymers to enhance its property of adsorbing catalysts; 2) catalyzing: immersing the conditioned substrate into a catalyst colloid-containing solution or a catalyst complex-containing solution to let the catalyst be adsorbed onto the substrate; 3) accelerating: reducing the catalyst with a suitable acid or basic solution (adapted to the catalyst colloid), or with a reducing agent (adapted to the catalyst complex) to reduce the catalyst being adsorbed onto the substrate; 4) enhancing: immersing the substrate after accelerating step into an enhancing agent containing a compound with two ligands; 5) electroplating: proceeding with a plating process.
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