Solder joint encapsulation material
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United States of America Patent
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Jun 2, 1998
Issued Date -
N/A
app pub date -
Jul 21, 1997
filing date -
Dec 4, 1995
priority date (Note) -
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status (Latency Note)
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Abstract
A method and encapsulation material are provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted with soldered leads to its substrate, in which encapsulation of the soldered lead joints serves to enhance the fatigue life of the solder joints. The encapsulation material is a reactive hot melt epoxy that is curable at temperatures significantly lower than that required for previous epoxy-based encapsulation materials. As such, processing of the circuit assembly is greatly facilitated, while the benefit of encapsulated solder joints is achieved for the assembly. The encapsulation material further includes a latent curative and a filler material for lower the coefficient of thermal expansion of the encapsulation material.
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