Photosensitive polymide materials for electronic packaging applications
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United States of America Patent
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May 26, 1998
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app pub date -
Oct 25, 1995
filing date -
Oct 25, 1995
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Abstract
Photosensitive polyimides (Ps-PIM) materials have been synthesized that belong to three families of Ps-PIM materials. Through the use of precursors, various catalytic compositions with differing photosensitivities are provided. The results are Ps-PIM materials having increased photosensitivities at wavelengths longer than approximately 330 to 350 nm and an associated catalytic system that is insensitive to oxygen. A variety of applications, including use in holographic systems, are improved by the present invention.
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