Process for structuring polymer films
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United States of America Patent
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May 5, 1998
Issued Date -
N/A
app pub date -
Aug 18, 1997
filing date -
Nov 23, 1993
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Abstract
A process for structuring polymer films, such as printed circuit boards and film boards, uses a plasma, which is formed in a container by the excitation of gas mixtures by microwaves, in which there is a control of the surface temperature of the polymer films during structuring by the plasma. By adjusting the parameters it is possible to operate just below a material-damaging temperature limit for polymer films, so that structures or microshapes are carefully plasma-eroded in polymer films. At high surface temperatures and with a dense plasma, structures or microshapes are rapidly eroded by the plasma, in which the structures or microshapes are homogeneously plasma-eroded with a uniform distribution of the surface temperature and gas flow. The surface temperature is maintained below the material-damaging temperature by controlling the power density of the microwave energy, the level of energy provided to a heater in the container, and the pressure of gas in the container in accordance with a time pattern algorithm using a computer.
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