Method and apparatus to wick solder from conductive surfaces
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United States of America Patent
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May 5, 1998
Issued Date -
N/A
app pub date -
Apr 8, 1996
filing date -
Apr 8, 1996
priority date (Note) -
Expired
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Abstract
A system for removing solder from an area grid array pad by applying a wire mesh to a conductive surface of the area grid array that is covered with solder. Heat is applied to the wire mesh and the conductive surface of the area grid array so that the solder flows from the conductive surface onto the wire mesh. The wire mesh is removed from the conductive surface thereby removing all solder from the conductive surface of the area grid array.
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