Method for making an electronic module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5745984
SERIAL NO

08500671

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Abstract

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A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

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Patent Owner(s)

Patent OwnerAddress
LOCKHEED MARTIN CORPORATION6801 ROCKLEDGE DRIVE BETHSEDA MD 20817

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cole, Jr Herbert Stanley Burnt Hills, NY 4 522
Sitnik-Nieters, Theresa Ann Clifton Park, NY 7 538

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  • 389 Citation Count
  • H05K Class
  • 99.43 % this patent is cited more than
  • 27 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges71527845241514652201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 90100 +0102030405060708090100110120130140150160

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