Encapsulated electronic component having a plurality of connection leads of martensitic structural-hardening conductive alloy
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United States of America Patent
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Apr 28, 1998
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N/A
app pub date -
Apr 25, 1996
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Apr 27, 1995
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Abstract
An encapsulated electronic component containing a plurality of connection leads and an outer case, where the connection leads extend externally to the outer case and contain martensitic structural-hardening conductive alloy.
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