Direct adhering polysilicon based strain gage
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United States of America Patent
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Apr 21, 1998
Grant Date -
N/A
app pub date -
May 26, 1995
filing date -
May 26, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An economical non-metallic strain gage insensitive to ambient temperature variations, and without a diode junction, which is suitable for general use and particularly for use in touch screens, wherein the gage is adapted to be directly adhered to the screen. The gage is metallized with a thin layer of a solderable metal for electrical soldering connection to strain measurement devices and for reliable mechanical support. The gage includes an etched polysilicon material on a substrate base, such as a silicon wafer, wherein the polysilicon is doped with a dopant material such that output measurements are independent of temperature changes.
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