Apparatus for attaching/detaching a land grid array component to a circuit board
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 21, 1998
Issued Date -
N/A
app pub date -
Aug 19, 1996
filing date -
Aug 19, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system is provided for selectively attaching or detaching a land grid array component to a surface of circuit board where the attachment is a grid array of solid conductive solder beads or balls. A chamber contains an inert liquid, and a heater heats the inert liquid to a temperature above the melting temperature of the solder beads. A fluid level adjustment means adjusts the level of the inert liquid in the chamber between a first level below the component and a second level above the component. A first mounting means supports the circuit board above the component, and a second mounting means is positioned at least partially in the container to support the component below the circuit board and to bias the component against the circuit board. An component/board assembly is positioned in the system. The beads are uniformly melted by raising the level of the inert liquid in the chamber to above the component to permit removal of the board. The beads of the grid array resolidify by lowering the level of the inert liquid in the chamber to below the component while the second mounting means biases the component against the circuit board, thereby reflowing the solder and establishing the solid conductive connections of the grid array.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully