Method and apparatus for cleaving semiconductor wafers
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United States of America Patent
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Apr 21, 1998
Grant Date -
N/A
app pub date -
May 17, 1994
filing date -
Aug 14, 1991
priority date (Note) -
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Abstract
A method and apparatus are described for cleaving a relatively thin semiconductor wafer for inspecting a target feature on a workface thereof by: producing, on a first lateral face of the semiconductor wafer, laterally of the workface on one side of the target feature, an indentation in alignment with the target feature; and inducing by impact, in a second lateral face of the semiconductor wafer, laterally of the workface on the opposite side of the target feature, a shock wave substantially in alignment with the target feature and the indentation on the first lateral face, to split the semiconductor wafer along a cleavage plane essentially coinciding with the target feature and the indentation.
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