Method of manufacturing multilayer foil printed circuit boards
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United States of America Patent
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-
Mar 24, 1998
Grant Date -
N/A
app pub date -
Mar 6, 1995
filing date -
Jul 7, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Multilayer printed circuit boards, foil printed circuit boards and metal-clad laminates for foil circuit boards and a process for the manufacture thereof, with interfacial connections structured in insulator layers, with resist openings of surface structured in resist coatings, with current paths structured in conductor layers and with contact points and in which for reducing the number of photochemical structurings or patternings required the interfacial connections and resist openings are mechanically structured, in that interfacial connection openings preworked in insulator layers are etched according to interfacial connection structures of mask foils, that in the interfacial connection openings are deposited electrically conductive deposition substances for the formation of contact layers in said openings. In the coating layers are etched resist openings according to contacting structures of mask foils, so that the resist openings form resist material-free areas on the circuit boards, foil circuit boards and metalclad laminates for foil circuit boards and the resist openings are worked in freely shaped manner and have circular cylindrical, circular, oval, square, rectangular or polygonal diameters.
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