Flowing solder in a gap
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United States of America Patent
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-
Mar 17, 1998
Grant Date -
N/A
app pub date -
May 9, 1997
filing date -
Feb 2, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention features a method for flowing solder in a gap between two surfaces. A supply of solder is heated to cause it to reflow and flow in the gap. The solder is directed to flow as a main stream in the gap and to flow as peripheral streams from the main stream toward edges of the gap to reduce formation of voids.
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